Manufacturer: Intel Corporation
Product Series: Intel Xeon Scalable Processors, 3rd Generation (Ice Lake‑SP)
Model: Xeon Platinum 8368
Order Number / MPN: CD8068904572001 (or SRKH8 depending on the supplier)
GTIN/EAN: 8592978314354
Product Type: Server Processor, 38 Cores, 76 Threads, LGA 4189

Cores and Threads:
- Number of Cores: 38
- Number of Threads: 76 (Hyper‑Threading enabled)
- SMT / Hyper‑Threading: Yes

Clock Speeds:
- Base Clock: 2.4 GHz
- Max. Turbo Clock (1 Core): up to 3.4 GHz
- All‑Core Turbo: approx. 3.0–3.2 GHz (depending on workload and cooling)

Cache:
- L3 Cache (Intel Smart Cache): 57 MB
- L2 Cache: approx. 1.25 MB per core (~47.5 MB total)
- L1 Cache: 32 KB Instruction + 48 KB Data per core

Memory Support:
- Memory Type: DDR4
- Supported Speeds: DDR4‑3200, DDR4‑2933, DDR4‑2666
- Maximum Memory Speed: 3,200 MT/s (DDR4‑3200)
- Number of Memory Channels: 8 (Octa‑Channel)
- Maximum Memory: up to 6 TB per socket
- ECC Memory: Yes
- Registered/Load‑Reduced DIMMs: Yes

PCI Express:
- PCIe Version: PCIe 4.0
- Number of PCIe Lanes: 64 per processor
- PCIe Bandwidth: approx. 126 GB/s (theoretical, bidirectional)

UPI (Intel Ultra Path Interconnect):
- UPI Version: UPI 2.0
- UPI Speed: 11.2 GT/s
- Number of UPI Links: 3
- 2-Socket and 4-Socket Configurations: Yes

Socket and Platform:
- Socket: FCLGA4189 (LGA 4189, Socket P+)
- Platform: Intel C620A chipset-based server platforms
- Scalability: 1S, 2S, and 4S configurations (platform-dependent)

Power Consumption and Thermals:
- TDP (Thermal Design Power): 270 W
- Tcase (max. case temperature): approx. 81 °C
- Required Cooling: High-performance server cooling solution for 270 W

Manufacturing Technology:
- Lithography: 10 nm (Intel 10 nm)
- Architecture: Ice Lake‑SP
- Chip Design: Monolithic

Instruction Sets and Extensions:
- ISA: x86‑64 (64-bit)
- ISA Extensions: SSE4.1, SSE4.2, AVX2, AVX‑512
- AES‑NI: Yes
- Virtualization Technologies: Intel VT‑x, VT‑d, EPT
- Additional Features: Intel Turbo Boost 2.0, Hyper‑Threading,
SpeedStep, Demand‑Based Switching

Applications:
- Virtualized server and cloud infrastructures
- Large database servers (OLTP, OLAP, mixed workloads)
- AI training and inference, deep learning
- HPC clusters, scientific simulations
- Enterprise applications, middleware, container platforms
- High-density virtualization and VDI